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3D Power Electronics Integration and Manufacturing Symposium

发布日期:2021/4/21 9:10:25 浏览量:398 分享:

The Third Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-21) will be held for the first time in Asia on June 21-23, 2021, at the Suita Campus of Osaka University Japan. Because Japan may not be open to foreign travellers, everyone can attend this live event virtually. You can switch between virtual and in-person attendance up to May 21st.

Deadline for Discounted Advanced Registration is April 30th

We are building on the continued 2016 and 2018 Symposia’s success with the 3D-PEIM-21, again assembling world-class experts representing far-reaching topics on additive, embedded, co-designed, and integrative packaging technologies. By creating the 3D-PEIM Symposium, the PSMA Packaging Committee offers power electronics researchers an excellent opportunity to learn about leading-edge R&D innovations in 3D power packaging. The focus of the Symposium will be on additive, embedded, co-designed, and integrative packaging technologies. Sessions will address mechanical, materials, reliability, and manufacturability issues in deploying smart power-dense components and modules, exploring the path to developing and manufacturing future 3D power electronics systems. Recognizing the importance of the Symposium, all previous speakers signed up for the postponed 2020 3D-PEIM event have committed to participating in our upcoming 2021 3D-PEIM.


Technical Program

The detailed program with time zone information for virtual attendees is available at www.3d-peim.org/program. The presentations will be live from both in-person and virtual presenters. Due to time zone challenges, all sessions will be recorded and available to paid attendees after the Symposium. 

Program Overview

       DAY 1

                      S1: Plenary I

                      S2: System Integration & Thermal Management

                      S3: Multiphysics Design & Tools

                      S4: Additive Manufacturing

              DAY 2

                      S5: Plenary II

                      S6: Manufacturing Technologies

                      S7: Materials

                      S8: Heterogeneous Integration

              DAY 3

                      S9: Quality & Reliability

                      S10: Sponsors Session  New in 2021!

                      Lab Tour

The Symposium will feature table-top exhibits during the breaks, lunch periods, and evening networking sessions for in-person attendees. Virtual attendees will be able to interact with speakers and the audience during live question and answer sessions. On the last day of the Symposium, in-person attendees are invited on a guided tour of the Osaka University Laboratory for Power Electronics and Electrical Energy and the Graduate School of Engineering Gallery. Additional information and registration details are available at www.3D-PEIM.org.




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